Qualcomm launches 45nm Snapdragon chipset with 3G ...

Qualcomm has developed a new version of its ARM processor-based Snapdragon platform with a next-generation chipset that uses 45nanometre process technology to provide faster processing, significant battery life improvements and other enhancements for smartphones and netbooks, as well as adding 3G data capability.
The Snapdragon QSD8650A chipset – scheduled for sampling before the end of 2009 – boosts the clock to 1.3GHz for 30 percent higher performance as well as enhanced multimedia and 2D/3D graphics, while reducing power consumption by 30% and a low standby power of less than 10 millwatts.

“This latest addition to the growing family of Snapdragon chipsets will help our customers to develop faster, more power-efficient smartphones and smartbooks,” said Luis Pineda, senior vice president of marketing and product management at Qualcomm CDMA Technologies. “This new 45 nm device shows our continued commitment to extending the capabilities of the Snapdragon platform with leading-edge process technology and an expanded list of integrated features.”

The QSD8650A chipset also offers multi-mode UMTS and CDMA 3G mobile broadband connectivity in the same 15x15mm package as current Snapdragon chipsets. A standalone, power-efficient 2D graphics accelerator and enhanced 3D graphics core deliver a powerful multimedia experience with better Adobe Flash performance. It also features integrated GPS and high-definition video recording and playback, the latest Bluetooth 2.1 technology and support for Wi-Fi, high-resolution WXGA displays and mobile TV technologies such as MediaFLO, DVB-H and ISDB-T.
This is interesting as Qualcomm had already has a 45nm dual core version, the QSD8672 that runs up to 1.5GHz, but there was obviously a need for a single core, lower cost, lower power version.

... as Snapdragon support grows
More than 15 manufacturers are now developing more than 30 Snapdragon-based products, the first of which is the Toshiba TG01 Smartphone, introduced in February 2009. Others on show in Taipei this week include ASUS, Compal Communications, Foxconn, High Tech Computer (HTC), Inventec and Wistron.

“The mobile industry is evolving, and it’s become apparent that consumers are more sophisticated in their expectations than ever before,” said Stephen Chen, president of Compal Communications. “Snapdragon’s integrated 3G mobile broadband brings a new level of connectivity and convenience to the smartphone and smartbook categories.”

Software developers now supporting Snapdragon chipsets include those developing:
Digital media services: Zinio
Multimedia players: RealNetworks, Inc, Bluestreak and Varia Mobile
Operating systems: Phoenix Technologies, ThunderSoft and Xandros
Productivity applications: Haansoft, Remoba
Social networking applications: Conveneer
System integration services: Bsquare, Movial