First standard 1.8in solid state drive modules

SLC and LMC modules to 64Gbytes

By Nick Flaherty  www.flaherty.co.uk
 

Taiwanese component maker Apacer Technology has launched the first modules for 1.8in solid state drives for the latest standard from JEDEC. The MO-300 specification for mSATA SSDs uses a 52-pin gold finger mSATA connector and has the mini PCIe form factor (50.8mmx29.8mm), and so is about 75% smaller than typical 2.5” SATA SSDs
Apacer’s SDMII M1 uses SLC (single-level cell) high-reliability flash memory and follows JEDEC MO-300’s mSATA SSD specification standards in terms of design, size and connector interface. It has a 52-pin gold finger mSATA connector and supports SATA 3.0 Gb/s transmission interface, with a maximum sequential read/write speed of up to 100/100 MB/sec and capacities available in 4GB - 32GB. To be more securely attached to the motherboard, the product features paired screw holes on its bottom, designed to enhance system safety while reducing vibration and shake.
To meet different customer requirements in terms of product cost, Apacer has also launched SDM II M1-M featuring MLC (Multi-Level Cell) flash memory for this product line, with its sequential read/write speed of up to 95/50 MB/sec and capacities available in 4GB - 64GB. In addition, in order to boost the product reliability, SDM II M1 and SDM II M1-M both boast many technological advantages, including Global Wear Leveling, S.M.A.R.T technology, 8-bit/15-bit ECC function and intelligent power failure recovery function. The modules are compliant with the MIL-STD-810F US military standard and mass production of both modules has started.

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Single mini USB for charging, audio and data

Freescale Semiconductor is introducing a mini USB interface IC that helps mobile device designers and manufacturers create smaller, sleeker consumer products by using a single mini USB connector for external accessories including chargers, headsets, microphones and audio/data connections.
In addition to saving valuable board space by eliminating the need for multiple connections, the MC34825 analog IC also lowers power consumption and extends battery life by supporting all-passive audio accessories such as stereo audio, microphone and cord remote control functionality.

“The MC34825 leverages Freescale’s 15 years of experience in delivering portable power management solutions that help our customers differentiate in competitive consumer electronics markets,” said Scott Ward, vice president and general manager of Freescale’s Analog, Mixed-Signal & Power Division. “This IC helps consumer device manufacturers give consumers what they want – smaller form factors and a single connection that eliminates the need for multiple adapters and cords.”

The chip can be used in smartbooks, netbooks, eBooks, mobile phones, smartphones, portable media players, portable navigation devices, digital still cameras and camcorders.
It uses uses intelligent switching to identify up to 32 different accessory types, such as headsets, microphones and chargers. It automatically identifies the attachment and informs the host system, switching the signal or setting the charge current based on the plugged-in charger.
As a universal charging solution, the MC34825 supports multiple charger types including AC, DC and USB. The IC identifies the battery charger type and sets the charge current level accordingly. Additional battery charging features include up to 28V OVP for the VBUS power input, ultra low operating current (<10uA at standby), a power-save mode and automatic detachment detection.

Key Intel deal with Nokia for mobile chips

Coming soon after Intel's acquisition of Wind River, the tie up of Intel and Nokia to develop new mobile chips is a telling move. Intel needs to migrate into the smartphone business before its laptop starts declining - the move to a 'pocketable' format is the key here.
Intel sees this step as further uniting the Internet with mobile phones and computers in a long-term relationship to develop a new class of Intel Architecture-based mobile computing device and chipset architectures which will combine the performance of powerful computers with high-bandwidth mobile broadband communications and ubiquitous Internet connectivity.
Both companies are expanding their longstanding relationship to define a new mobile platform beyond today's smartphones, notebooks and netbooks, enabling the development of a variety of innovative hardware, software and mobile Internet services.
Taking advantage of each company's expertise as leaders in their respective fields, these future standards-based devices will marry the best features and capabilities of the computing and communications worlds and will transform the user experience, bringing incredible mobile applications and always on, always connected wireless Internet access in a user-friendly pocketable form factor.
The Intel and Nokia effort includes collaboration in several open source mobile Linux software projects. Intel will also acquire a Nokia HSPA/3G modem IP license for use in future products.
"This Intel and Nokia collaboration unites and focuses many of the brightest computing and communications minds in the world, and will ultimately deliver open and standards-based technologies, which history shows drive rapid innovation, adoption and consumer choice," said Anand Chandrasekher, Intel Corporation senior vice president and general manager, Ultra Mobility Group. "With the convergence of the Internet and mobility as the team's only barrier, I can only imagine the innovation that will come out of our unique relationship with Nokia. The possibilities are endless."
The effort also includes technology development and cooperation in several open source software initiatives in order to develop common technologies for use in the Moblin and Maemo platform projects, which will deliver Linux-based operating systems for these future mobile computing devices.
The companies are coordinating their Open Source technology selection and development investments, including alignment on a range of key Open Source technologies for Mobile Computing such as: oFono*, ConnMan*, Mozilla*, X.Org*, BlueZ*, D-BUS*, Tracker*, GStreamer*, PulseAudio*. Collectively, these technologies will provide an open source standards-based means to deliver a wealth of mobile Internet and communication experiences, with rich graphics and multimedia capabilities.
Hosted by the Linux Foundation, Moblin is an optimized open source Linux operating system project for Atom-based MIDs, netbooks, nettops, in-vehicle infotainment (IVI), and embedded systems.
Maemo is a Linux operating system, mostly based on open source code and powers mobile computers such as the Nokia N810 Internet Tablet. The Maemo platform has been developed by Nokia in collaboration with many open source projects. For more information see www.maemo.org.

HSPA modem license

Building on today's announcement, Intel and Nokia have signed an agreement that will enable Intel to license Nokia's HSPA/3G modem technologies with the aim of developing advanced mobile computing solutions that deliver a powerful and flexible computing experience, combining 3GPP modem technology with the high performance and low power consumption of future Intel Architecture-based platforms.
The Nokia modem license complements Intel's broadband wireless technologies and will enable the company to extend chipset solutions incorporating Nokia's modem technologies across its mobility offerings in the future.

MPEG LA eyes up LTE patents

Patent pool expert MPEG LA says it is making significant progress working with a group of interested companies to create a joint patent pool license for the Long Term Evolution (LTE) Standard for mobile telecommunications. It is calling for interested parties, both with patents and patent applications, to be part of the pool.
MPEG LA’s efforts, started last year, have been directed toward educating the market about the benefits of a pool license to address the patent thicket around this next generation wireless technology and assist the market with its adoption. A fight or uncertainty over the patent situation would dramatically slow the adoption of the the technology, as happened with high definition video and the AVC patents.
“The market is ready, and we are proud that industry leading companies have invited us to facilitate creation of an LTE pool license,” said MPEG LA President and CEO Larry Horn.

“Given the history of telecommunications patent pools, MPEG LA has taken the time to consult directly with mobile network operators, network equipment manufacturers and mobile handset companies regarding the benefits of a patent pool for LTE, and they have encouraged MPEG LA to move forward with this effort. Next generation wireless technology, with its multifunctional capabilities, begs for a patent pool licensing alternative to make its full potential available to consumers worldwide, and MPEG LA’s success in creating large pool licenses uniquely positions us to achieve it.”

MPEG LA would like as many essential patent holders as possible to be included in this process. Therefore, MPEG LA invites any party that believes it has patents that are essential to the LTE Standard to submit them by June 19, 2009 for evaluation of their essentiality by MPEG LA’s patent evaluators in order to participate in the creation of a joint LTE patent license.
Although only issued patents will be included in the license, in order to participate in the license development process, patent applications with claims that their owners believe are essential to the LTE Standard and likely to issue in a patent also may be submitted.
A key point is that, although the process will begin with LTE, it may be expanded at a later stage to provide coverage for backward compatibility with other mobile
telecommunications technologies.
http://www.mpegla.com/pid/lte.

MIPI update on mobile standards

The Mobile Industry Processor Interface (MIPI®) Alliance, the industry initiative established five years ago to define and promote open standards for hardware and software interfaces in mobile terminals, has introduced seven key standards over the last year. Collectively these new specifications will help the industry to provide optimized and efficient mobile terminals.
As these standards are implemented in mobile device technology the industry will see benefits such as better interconnection among devices and components such as cellular telephones, handheld computers, digital cameras, and multimedia devices; higher data exchange rates among devices; prioritization of traffic; better adaptation and interoperability of devices from different vendors; and more cost and power efficient mobile terminals, among others.
The new MIPI Alliance Specifications introduced in 2008 include:

-Unified Protocol (UniProSM) v1.00.00
-Display Serial Interface (DSI) v1.01.00
-Processor Interface Emulation (PIE) v0.90.00
-Dual Mode 2.5G/3G Baseband/RFIC Interface v3.09.04 (DigRFSM)
-Device Descriptor Block (DDB) v0.82.01
-Serial Low-power Inter-chip Media Bus (SLIMbusSM) v1.01.00
-System Power Management Interface (SPMI) v1.00.00

MIPI brings together 165 leading companies from around the world in pursuit of open standards to converge interfaces inside mobile terminals. MIPI standards drive consistency in interfaces, promoting reuse and compatibility in mobile terminals while accelerating the delivery of these devices to users. These new specifications are designed to help achieve these goals.

"With the growing trend to advanced LTE technology and increased integration of new applications into mobile devices, MIPI's importance in the wireless world is becoming obvious," said Will Strauss, President and Principal Analyst of Forward Concepts. "The need for interoperability among several vendors is highlighted as wireless operators continue to seek the best available products at competitive prices. MIPI Alliance specifications provide certainty in interfacing between vendors."

"Infineon Technologies with its strong commitment to open standards has developed products adopting MIPI Alliance specifications for Camera (CSI), Display (DSI) and DigRF. Our ongoing contributions in RF Front-End Control (RFFE), System Power Management (SPM), Test & Debug, UniPro (Unified Protocol), Serial Low-power Inter-chip Media Bus (SLIMbus) working groups and our strong engagement particularly in Physical Layer (M-PHY) and DigRF working groups will drive interoperability even further." Weng-Kuan Tan, Division President, Wireless Solutions at Infineon.

MIPI Specifications are currently available only to MIPI Alliance member companies. Interested companies are welcome to join the MIPI Alliance. Membership includes limited royalty-free intellectual property rights and obligations at www.mipi.org.
More than 165 member companies participate in the MIPI Alliance, including nearly every leading supplier of mobile phones, applications processors, baseband modems, display panels, camera sensors, and audio and power peripherals. A complete list of member companies can be found at www.mipi.org.