Connector-free, high-capacity, embedded SSDs for a new generation of tablets and ultrathin notebooks
Memory maker SanDisk has implemented the new SATA µSSD specification into its SanDisk iSSDproduct line of postage stamp-sized embedded SSDs. SATA-IO, an industry consortium dedicated to sustaining the quality, integrity and dissemination of serial ATA (SATA) technology, introduced the standard today.
The number of media tablets shipped worldwide is expected to grow from 17.8 million units in 2010 to 53.5 million units in 2011 according to IDC.
Embedded SSDs offer fast performance in a tiny footprint, making them an attractive solution for all categories of ultrathin devices. The SATA µSSD specification eliminates the module connector from the traditional SATA interface, enabling developers to produce a single-chip SATA implementation for embedded storage applications. Among the first products to implement the new standard, the SanDisk iSSD series is an ideal storage solution for OEMs developing the next generation of thin, powerful mobile computing platforms.
“To widely adopt a new component technology, manufacturers need to have confidence in its performance, longevity and cost-effectiveness,” said Jeff Janukowicz, research manager, solid state storage technology at IDC. “Today’s announcement of an industry-wide standardization for embedded SSDs, combined with OEM requirements for size and performance gains in storage, should help propel the market for these tiny, versatile drives.”
“Connector-free embedded SSDs allow OEMs to develop a new generation of thin yet powerful tablets and ultrathin notebooks,” said Kevin Conley, senior vice president, client storage solutions, SanDisk. “Initiatives such as the µSSD specification promote the development of new standards for storage solutions that help manufacturers continually refine their end consumer product and drive new industry sectors.”
The SATA µSSD standard-conforming SanDisk iSSD series utilizes a new electrical pin-out that allows SATA delivery using a single ball grid array (BGA) package. The BGA package sits directly on the motherboard, allowing for form factors as small as 16mm x 20mm x 1.2mm (up to 32GB)/1.4mm (for 64GB) and 16mm x 20mm x 1.85mm (for 128GB). The SanDisk iSSD i100 SSD is available in 8 gigabyte (GB)1 to 128GB capacities, offering OEMs a flexible range of storage options.
“The market for tablets and ultrathin computing devices continues to grow along with the need for small form factor storage solutions,” said Mladen Luksic, president, SATA-IO. “We are excited to have industry-wide support for the µSSD specification and look forward to seeing many µSSD-based products available in the near future.”
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