SiGe Semiconductor has launched a silicon RF switch/LNA Front End IC (FEIC) designed to enhance the performance and functionality of converged Bluetooth/Wi-Fi chipsets for embedded applications. The new device addresses the increasing convergence of Wi-Fi and Bluetooth for the new generations of smartphones, netbooks, personal media players and digital cameras.
“With the SE2601T we are providing our customers with a single-chip solution integrating a SP3T RF switch and Wi-Fi receive path low noise amplifier (LNA),” said Sanjiv Shah, Marketing Director Embedded Products at SiGe. “The SE2601T, which integrates features that until now have been discrete on the device motherboard or inside of a module solution, occupies less board space and offers significant advantages for designers of today’s cool, feature-rich mobile devices”.
SiGe developed the SE2601T to enhance the performance and functionality of Bluetooth/Wi-Fi chipset solutions using an integrated CMOS power amplifier (PA).
The 2601T leverages the performance and functional integration strengths of silicon-based RF solutions. The 2601T improves the connectivity range of the Wi-Fi solution by placing a high-performance LNA between the antenna and the RF receiver that is part of chipsets from leading vendors such as CSR, Marvell, Broadcom and Atheros. Often the LNA function is omitted in embedded applications such as smartphones due to physical space constraints on the Wi-Fi solution, thus degrading connectivity performance. This LNA significantly increases the sensitivity of the Wi-Fi receiving system – critical in embedded applications where physically small antennas are limited in their contribution to signal quality. The RF switch function – supporting antenna sharing between Bluetooth and 802.11bgn functions – is typically a discrete device requiring additional passives and consuming more space than the integrated 2601T solution. Thus the 2601T significantly decreases the footprint required for enhancing Wi-Fi performance while supporting a shared antenna for Bluetooth and Wi-Fi functions.
From a competitive standpoint, the 2601T integrates the required DC blocking capacitors through the use of a silicon-based IC process. The GaAs-based competition for the 2601T requires external capacitors consuming additional circuit board space and causing incremental increase in bill of materials cost for the Wi-Fi solution.
In a 2x2mm QFN package, the 2601T is best suited to direct placement on the embedded device’s motherboard.
“The SE2601T provides our customers with an integrated solution for their designs, addressing some of the industry’s fastest growing market segments,” said Shah. “The reduced design time it supports, with the smallest footprint for its functionality as well as the reduction of the number of components required ."
Pricing and availability: The SE2601T is priced at $0.35 in quantities of 10,000 units.
It is sampling now and is offered with product and evaluation board datasheets and extensive application notes surrounding the use and implementation of the device
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